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TSSOP
Thin Shrink Small Outline Package
The TSSOP package offers smaller body sizes and smaller lead pitches with package thickness (0.9mm thick) over standard SOIC packages. Body sizes are 3.0mm, 4.4mm and 6.1mm. Lead counts range from 8 to 56. Standard lead pitch is .65mm. This package conforms to JEDEC package outlines |
Amkor ExposedPad TSSOP |
Part Number | Number of Pins |
Body Width | Pitch | Tape Width |
Tape Pitch | Quantity Per Tube |
Quantity Per Reel |
TSSOP8T-3.0mm | 8 | 3.0mm | .65mm | 12mm | 8mm | 98 | 2,500 |
TSSOP8T-4.4mm | 8 | 4.4mm | .65mm | 12/16mm | 8mm | 100 | 1,000/2,500 |
TSSOP10T-3.0mm | 10 | 3.0mm | .65mm | 12mm | 8mm | 98 | 2,500 |
TSSOP14T-4.4mm | 14 | 4.4mm | .65mm | 12/16mm | 8mm | 96 | 1,000/2,500 |
TSSOP16T-4.4mm | 16 | 4.4mm | .65mm | 12/16mm | 8mm | 96 | 1,000/2,500 |
TSSOP20T-4.4mm | 20 | 4.4mm | .65mm | 16mm | 8/12mm | 74 | 1,000/2,500 |
TSSOP24T-4.4mm | 24 | 4.4mm | .65mm | 16mm | 8/12mm | 62 | 1,000/2,500 |
TSSOP28T-4.4mm | 28 | 4.4mm | .65mm | 16mm | 8/12mm | 50 | 1,000 |
TSSOP28T-6.1mm | 28 | 6.1mm | .65mm | 24mm | 12mm | 50 | 1,000 |
TSSOP30T-4.4mm | 30 | 4.4mm | .5mm | 16mm | 8mm | 62 | 1,000 |
TSSOP32T-6.1mm | 32 | 6.1 | .65mm | 24mm | 12mm | 44 | 1,000 |
TSSOP38T-4.4mm | 38 | 4.4mm | .5mm | 16mm | 8/12mm | 50 | 1,000 |
TSSOP38T-6.1mm | 38 | 6.1mm | .65mm | 24mm | 12mm | 39 | 1,000 |
TSSOP44T-4.4mm | 44 | 4.4mm | .5mm | 24mm | 12mm | 42 | 1,000 |
TSSOP48T-4.4mm | 48 | 4.4mm | .4mm | 16mm | 8mm | 50 | 1,000 |
TSSOP48T-6.1mm | 48 | 6.1mm | .5mm | 24mm | 12mm | 39 | 1,000 |
TSSOP56T-4.4mm | 56 | 4.4mm | .4mm | 24mm | 12mm | 42 | 1,000 |
TSSOP56T-6.1mm | 56 | 6.1mm | .5mm | 24mm | 12mm | 35 | 1,000 |
TSSOP64T-6.1mm | 64 | 6.1mm | .5mm | N/A | N/A | 28 | N/A |
TSSOP80T-6.1mm | 80 | 6.1mm | .4mm | N/A | N/A | 28 | N/A |
- 0.9mm body thickness for 4.4 and 6.1mm body sizes.
- 0.85mm body thickness for 3.0mm body size.
- JEDEC package outline is standard.
- Hi-conductivity copper leadframes.
- Very low-stress mold compound.
- Tube quantity may vary.
- Carrier tape is plastic.