Products > Practical > Dummy Components > µBGA® > TV-208A

Back to µBGA

TV208 Drawing

TV-208 Notes

  • 2–metal utilizes substrate enabling high density and high performance.
  • Small chip-size footprint and low profile enables small form factor solutions.
  • No under-fill is needed, providing the option to rework.
  • JEDEC level 1 moisture resistance eliminates the need for special packaging and handling.
  • Unique compliant layer relieves thermo-mechanical stress providing superior reliability.
  • Exposed back surface of the die provides excellent thermal junction for efficient thermal management.
  • Short lead length provides excellent electrical characteristics.
  • Lightweight for portable designs.
Back to µBGA
  |  Print page