Products > Practical > Amkor Technology > PQ2 & PQ4 QFP

PowerQuad®
QFP Quad Flat Pack

The QFP PowerQuad® 2 (PQ2) is patented, advanced IC packaging technology with excellent attributes in thermal and electrical performance. The IC is attached directly to this large, highly efficient heatsink, which readily extracts generated heat under demand situations.

The large heatsink also provides a “floating” ground plane to the signal leads, reducing self-inductance by 50% (over conventional plastic QFPs). Additionally, the patented PQ2 heatsink has integrated mechanical “locking” features to ensure package integrity while eliminating moisture penetration.

QFP PowerQuad 2

Also see ...
QFP

Part Number Number
of Pins
Body
Pitch
Lead
Pitch
Footprint Quantity
Per Tray
Tape
Width
Tape
Pitch
Quantity
Per Reel
A-PQ2-QFP80-14X20mm-.8mm-3.2 80 14 x 20mm .8mm 3.2mm 50/66 44mm 32mm 350
A-PQ2-QFP80-14X20mm-.8mm-3.9 80 14 x 20mm .8mm 3.9mm 50/66 44mm 32mm 350
A-PQ2-QFP100-14X20mm-.65mm-3.2 100 14 x 20mm .65mm 3.2mm 50/66 44mm 32mm 200
A-PQ2-QFP100-14X20mm-.65mm-3.9 100 14 x 20mm .65mm 3.9mm 50/66 44mm 32mm 200
A-PQ2-QFP120-28mm-.8mm-3.2 120 28mm sq .8mm 3.2mm 24 44mm 40mm 200
A-PQ2-QFP128-14X20mm-.5mm-3.2 128 14 x 20mm .5mm 3.2mm 66 44mm 32mm 200
A-PQ2-QFP128-14X20mm-.5mm-3.9 128 14 x 20mm .5mm 3.9mm 66 44mm 32mm 200
A-PQ2-QFP128-28mm-.8mm-3.2 128 28mm sq .8mm 3.2mm 24 44mm 40mm 200
A-PQ2-QFP144-28mm-.65mm-3.2 128 28mm sq .65mm 3.2mm 24 44mm 40mm 200
A-PQ2-QFP160-28mm-.65mm-3.2 160 28mm sq .65mm 3.2mm 24 44mm 40mm 200
A-PQ2-QFP208-28mm-.5mm-2.6 208 28mm sq .5mm 2.6mm 24 44mm 40mm 200
A-PQ2-QFP240-32mm-.5mm-2.6 240 32mm sq .5mm 2.6mm 24
A-PQ2-QFP256-28mm-.4mm-2.6 256 28mm sq .4mm 2.6mm 24 44mm 40mm 200
A-PQ2-QFP256-28mm-.4mm-3.2 256 28mm sq .4mm 3.2mm 24 44mm 40mm 200
A-PQ2-QFP304-40mm-.5mm-2.6 304 40mm sq .5mm 2.6mm 12
  • Very high conductive, solid copper heatsink.
  • 50% reduction in package self-inductance.
  • 80 – 304 lead counts (14 x 20mm to 40 x 40mm body size).
  • Industry-accepted JEDEC package outlines.
  • Available in “THIN” LQFP formats.
  • Low stress mold compound.
  • Heatsink-up and heatsink-down configurations available.
  • ~100% improvement in Theta JA over standard QFP.

PowerQuad QFP PQ2 Cross-Section Drawing

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