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Epoxy Mold Release


Apply this release to a surface before pouring in encapsulating and potting compound. It allows for a clean removal of the cured epoxy. For use with all types of epoxies and phenolic resins.

Part Number Mfr. Part # Sizes Available Description
MG-8329-350G 8329-350G 350g (12.3 oz) Aerosol
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