Products > MG Chemicals > Thermally Conductive Epoxy
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Thermally Conductive Epoxy Encapsulating & Potting
Compound |
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100% solids. Formulated with undiluted Bis F resin for superior physical
properties, and pigmented with high purity aluminum oxide pigment to provide
excellent thermal conductivity at reasonable cost. Pigmented black for excellent
thermal absorption and emission.
- Provides superior protection from impact, shock, conductivity, moisture,
abuse, chemicals, and analysis.
- Two part epoxy, with a 1 to 1 mixing ratio by volume.
- Two hour working time
- Suitable for large production runs
- Cures in 2 days at room temperature or one hour at 65°C.
Specifications
Uncured Properties - Resin [Part A] |
Viscosity |
41,100 cps |
Specific Gravity |
1.8019 |
Color |
Black |
Uncured Properties - Hardener [Part B] |
Viscosity |
68,900 cps |
Specific Gravity |
1.5036 |
Color |
Black |
Cured Properties - PHYSICAL |
Test Method |
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Mixed Viscosity
|
76,300 cps |
Mixed Specific Gravity
|
1.6156 |
Volume Mix Ratio (resin:hardener)
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1:1 |
Working time (100g)
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120 min. |
Cure Time (100g, room temp.)
|
24 hours |
Heat Cure Time (100g, 65°C)
|
60 min. |
Shore Hardness
|
82 Shore D |
Tensile strength |
ASTM-D-638-02A |
2734 psi |
Elongation |
ASTM-D-638-02A |
1.87% |
Compression strength |
ASTM-D-638-02A |
4,088 psi |
Flexural strength |
ASTM-D-790-03 |
5,352 psi |
Cantilever Beam (IZOD) Impact
|
ASTM-D-256-02 E1 |
0.80 ft lb ft / in |
Shear Strength ASTM-E-831-03 |
ASTM-E-831-03 |
3.224 psi |
Cured Properties - TEMPERATURE |
Test Method |
|
Constant Service Temperature |
ASTM-D-648-01 |
35.35°C (95.6°F) |
Dielectric Constant |
ASTM-D-150-98 |
4.41 |
Dissipation Factor |
ASTM-D-150-98 |
0.0113 |
Volume Resistivity |
ASTM-D-257-99 |
2.58 x 1015 ohm · cm |
Surface Resistivity |
ASTM-D-257-99 |
3.16 x 1016 ohm · cm |
Heat Deflection Temperature |
ASTM-D-648-01 |
35.35°C (95.6°F) |
Intermediate Service Temp. |
|
110°C (230°F) |
Thermal Conductivity |
|
0.682 W/m*K |
Thermal Diffusivity |
|
0.38 mm2/s |
Volumetric Specific Heat |
|
1.9MJ/m3*K |
Chemical and Solvent Resistance |
Change after 3 days |
Hydrocloric Acid |
< 0.50% |
Isopropyl Alcohol |
~ 0% |
Ethyl Lactate |
< 1 % |
Acetone |
< 3% |
Xylene |
< 2% |
Iso hexanes |
~ 0% |
Mineral spirits |
~ 0% |
Part Number |
Mfr. Part # |
Sizes Available |
Description |
Epoxy - Black, Thermally Conductive Encapsulating &
Potting Compound |
MG-832TC-450ML |
832TC-450ML |
450mL kit (16 oz) |
Liquid |
MG-832TC-2L |
832TC-2L |
2 liter kit (0.5 gal) |
Liquid |
MG-832TC-40L |
832TC-40L |
40 liter kit (10 gal) |
Liquid |
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