Products > MG Chemicals > Encapsulating and Potting Epoxy Compound (Black)

Black Epoxy Encapsulating and Potting Compound
ATTENTION
Mixing ratio for this product is 2 parts A to 1 part of B. Please be advised that there is a misprint on our label for one of the production runs.

Protects sensitive electronic components from impact, shock, vibration, heat, conductivity, moisture, chemicals, and visual inspection.

Features

  • Non-porous, water and chemical resistant
  • Extremely impact resistant (contains a form of nylon)
  • Colored black, to prevent visual inspection
  • Affords high security, once cured, extremely difficult to remove
  • Non-conductive, an electrical insulator
  • Low toxicity
  • Suitable for explosion proof components (spark arresting)
  • Easy and simple to mix
  • Long pot life
  • Can be cured in one hour at 65°C (150°F)
  • This product is RoHS compliant

 Specifications

Uncured Properties - Resin [Part A]
Viscosity 2,500 cps
Specific Gravity 1.1273
Color Black
Uncured Properties - Hardener [Part B]
Viscosity 11,000 cps
Specific Gravity 0.9564
Color Clear, amber tint
Cured Properties - PHYSICAL
Mixed Viscosity 3,300 cps
Mixed Specific Gravity 1.0577
Volume Mix Ratio (resin:hardener) 2.0:1
Mass Mix Ratio (resin:hardener) 2.3:1
Shore Hardness 80 - 82 Shore D
Tensile strength (ASTM D 638) 8475 psi
Elongation 3.3%
Compression strength (ASTM D 695) 14,675 psi
Modulus 375,000 psi
Flexural strength (ASTM D 790) 16,500 psi
Modulus 427,000 psi
Izod impact strength (ASTM D 256) 0.443 ft-lbs / inch notch
0.259" thick
Lap Shear Strength(ASTM D 732) 957 psi
Working time (100g) 60 min.
Cure Time (100g, room temp.) 24 hours
Heat Cure Time (100g, 65°C) 60 min.
Cured Properties - TEMPERATURE
Coefficient of Thermal Expansion
(ASTM E 831)
0.036" / 10" @ 32°F,
0.013" / 10" @ 72°F
Constant Service Temperature 140°C (284°F)
Intermediate Service Temperature
145°C (293°F)
Heat Deflection Temp. (264 psi)
(ASTM D 648)
46.638°C (115.95°F)
Cured Properties - ELECTRICAL
Volume Resistivity (ASTM D 257) 3.1 x 1010 ohms
Surface Resistivity (ASTM D 257) 5.3 x 1012 ohm · cm
Dielectric Strength (0.124" thick)
(ASTM D 149)
402 V / mil, 60 Hz
Dielectric Constant (ASTM D 150) 3.9 @ 60Hz
Dissipation Factor 0.007 @ 23°C, 60Hz
Insulative Yes
Conductive No
Chemical and Solvent Resistance
  Change after
3 days
Change after
45 days
Hydrocloric Acid < 0% < 1 %
Isopropyl Alcohol < 0.3 % < 1 %
Ethyl Lactate < 3 % < 7 %
Acetone < 7% destroyed
Xylene < 2% < 9 %
Iso hexanes < 5 % < 8 %
Mineral spirits < 0.3 % < 0.3 %

 

Part Number Mfr. Part # Sizes Available Description
MG-832B-375ML 832B-375ML 375ml (12 oz) Liquid
MG-832B-3L 832B-3L 3L (0.8 gal) Liquid
MG-832B-60L 832B-60L 60L (16 gal) Liquid
Quick Links

MSDS Black Part A
MSDS Black Part B

AppGuide

 

Encapsulating & Potting
Compound Available
colors:

Clear
Black

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